08-08-2017, 09:50 PM
I tried to post a comment under the "How to Build the Mixed Scale Digital Readout Kit" but couldn't seem to get it to take.
The text of that comment is as follows:
Yuri, re the Bluetooth Module.
Is there any reason I couldn't bend the leads at right angles as you did, but bend them the other way such that the BT module sits *under* the PCB (with some gap)?
This would have the advantage of staying within the PCB profile at a small cost in height. If the PCB were mounted on stand-offs, the BT module could sit in the gap.
Perhaps it could be answered here?
The text of that comment is as follows:
Yuri, re the Bluetooth Module.
Is there any reason I couldn't bend the leads at right angles as you did, but bend them the other way such that the BT module sits *under* the PCB (with some gap)?
This would have the advantage of staying within the PCB profile at a small cost in height. If the PCB were mounted on stand-offs, the BT module could sit in the gap.
Perhaps it could be answered here?